01 September 2008
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Sealing and potting

ThreeBond has introduced the 2212B single-part epoxy resin which has been formulated for low temperature and fast curing.

"We are addressing the needs of our customers in the electronics sector with this product", says ThreeBond's Mick Beeson. "It offers excellent electrical properties, excellent chemical resistance, and high mechanical strength."

The resin has been developed for general boding, sealing, potting, and moulding, and can cure at temperatures of 80ºC in 30 minutes; a one-minute cure can be obtained at 150ºC. "The resulting benefits include usage on temperature-critical components, energy savings, no mixing, and simplified automation."

Unlike two-component compounds 2212B requires no weighing, mixing, stirring, de-foaming, or other time-consuming operations, Mick Beeson points out. Availability is in quantities of 1kg, 4kg, and 20kg.

Three Bond will be exhibiting at the Fastening & Assembly Solutions Show, National Motorcycle Museum, 23 October.

Author
Paul Gay

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